Datacon 8800 FC QUANTUM hS

Note : Your request will be directed to BE Semiconductor Industries N.V..

Datacon 8800 FC QUANTUM hS Image

Product Specifications

Product Details

  • Part Number
    Datacon 8800 FC QUANTUM hS
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    0.5 to 15 N
  • Bonding Method
    Flip Chip Bonder
  • Field of View
    29 x 29 mm, 16 x 16 mm
  • Net Weight
    2000 kg
  • Overall Dimensions
    1600 x 1983 x 1940 mm
  • Substrate Working Range
    325 x 203 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    1 x 1 to 14 x 14 mm
  • Wafer Die Thickness
    0.05 to 2 mm
  • Wafer Flip Chip Placement Speed
    Up to 16000 UPH
  • Wafer Size
    8 to 12 Inches
  • X Y Placement Accuracy
    ± 4 µm at 3 sigma

Technical Documents