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Datacon 8800 TC advanced

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Product Specifications

Product Details

  • Part Number
    Datacon 8800 TC advanced
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    3 to 250 N
  • Bond Head
    2 Heads
  • Bonding Method
    Flip Chip Bonder
  • Co Planarity
    ± 2 µm at 10 mm
  • Field of View
    12 x 12 mm
  • Frame Size
    125 to 375 mm
  • Overall Dimensions
    1600 x 1200 x 1880 mm
  • Ramping Speed
    + 200 Degee C/s (Heating), - 100 Degree C/s (Cooling)
  • Standard Bond Head
    -4 to 4 Degree rotation
  • Temperature Uniformity
    ± 5 Degree C
  • Type
    Automatic
  • Wafer Die Attach Size
    2 to 16 mm
  • Wafer Die Thickness
    50 µm to 3 mm
  • Wafer Flip Chip Placement Speed
    Up to 1000 UPH
  • Wafer Size
    200 to 300 mm
  • X Y Placement Accuracy
    ± 2 µm at 3 sigma

Technical Documents
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