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Esec 2009 SSIE

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Product Specifications

Product Details

  • Part Number
    Esec 2009 SSIE
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    50 N, 150 N
  • Bonding Method
    Die Bonder
  • Bonding Time
    0 to 32 sec
  • Frame Size
    152.4 mm, 203 mm, 305 mm
  • Net Weight
    830 kg
  • Overall Dimensions
    1970 x 1305 x 1760 mm
  • Substrate Working Range
    280 x 80 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    2500 to 8000 UPH
  • Wafer Die Attach Size
    1 x 1 mm to 11 x 11 mm
  • Wafer Size
    Up to 8 Inches, 12 Inches
  • X Y Placement Accuracy
    60 µm

Technical Documents
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