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Esec 2100 FC hS

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Product Specifications

Product Details

  • Part Number
    Esec 2100 FC hS
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    0.2 N
  • Bonding Method
    Flip Chip Bonder
  • Frame Size
    152.4 mm, 203 mm, 305 mm
  • Net Weight
    1400 kg
  • Overall Dimensions
    1430 x 1440 x 1400 mm
  • Substrate Working Range
    500 x 125 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.2 to 20 mm
  • Wafer Die Thickness
    = 0.05 mm
  • Wafer Flip Chip Placement Speed
    Up to 12000 UPH
  • Wafer Flip Chip Without Dipping Placement Speed
    Up to 16000 UPH
  • Wafer Size
    4 to 12 Inches
  • X Y Placement Accuracy
    8 µm

Technical Documents
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