Esec 2100 SC

Note : Your request will be directed to BE Semiconductor Industries N.V..

Esec 2100 SC Image

Product Specifications

Product Details

  • Part Number
    Esec 2100 SC
  • Manufacturer
    BE Semiconductor Industries N.V.

General Parameters

  • Bond Force
    50 N
  • Bonding Method
    Die Bonder
  • Frame Size
    203 x 305
  • Overall Dimensions
    3040 x 1448 x 1680 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.5 to 20 mm
  • Wafer Size
    4 to 12 Inches
  • X Y Placement Accuracy
    Down to 25 µm

Technical Documents