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BESTEM-D311plus

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Product Specifications

Product Details

  • Part Number
    BESTEM-D311plus
  • Manufacturer
    Canon Machinery Inc

General Parameters

  • Bonding Cycle Time
    0.300 sec/cycle
  • Bonding Method
    Die Bonder
  • Compressed Air
    0.4 MPa (60L/min)
  • Frame Size
    260 x 102 mm
  • Net Weight
    1500 kg
  • Overall Dimensions
    1860 x 1282 x 1622 mm
  • Power Supply
    AC200V 15A
  • Substrate Thickness
    0.1 to 1 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.3 to 8.0 mm
  • Wafer Die Thickness
    0.15 to 2 mm
  • Wafer Size
    8 Inches
  • X Y Placement Accuracy
    ±15 µm

Technical Documents
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