1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
  5. Canon Machinery Inc
  6. BESTEM-D510

BESTEM-D510

Download Datasheet Request Information

Note : Your request will be directed to Canon Machinery Inc.

BESTEM-D510 Image

Product Specifications

Product Details

  • Part Number
    BESTEM-D510
  • Manufacturer
    Canon Machinery Inc

General Parameters

  • Bonding Cycle Time
    0.257 sec/cycle
  • Bonding Method
    Die Bonder
  • Compressed Air
    0.4 MPa (60L/min)
  • Frame Size
    300 x 102 mm
  • Net Weight
    1600 kg
  • Overall Dimensions
    1930 x 1400 x 1600 mm
  • Power Supply
    AC 200 V 30 A
  • Substrate Thickness
    0.075 to 2 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    3 to 8 mm
  • Wafer Die Thickness
    0.075 to 2 mm
  • Wafer Size
    12 Inches max
  • X Y Placement Accuracy
    ± 25 µm

Technical Documents
View similar products