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BESTEM-D511f plus

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Product Specifications

Product Details

  • Part Number
    BESTEM-D511f plus
  • Manufacturer
    Canon Machinery Inc

General Parameters

  • Bonding Cycle Time
    0.45 sec/cycle
  • Bonding Method
    Flip Chip Bonder
  • Compressed Air
    0.4 MPa (60L/min)
  • Frame Size
    300 x 102 mm
  • Net Weight
    1600 kg
  • Overall Dimensions
    1900 x 1400 x 1600 mm
  • Power Supply
    AC200V 30A
  • Substrate Thickness
    0.075 to 2 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.3 to 8 mm
  • Wafer Die Thickness
    0.075 to 5.0 mm
  • Wafer Size
    12 Inches max
  • X Y Placement Accuracy
    ± 12 µm

Technical Documents
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