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BESTEM-D540

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Product Specifications

Product Details

  • Part Number
    BESTEM-D540
  • Manufacturer
    Canon Machinery Inc

General Parameters

  • Bonding Cycle Time
    0.6 sec/cycle
  • Bonding Method
    Die Bonder
  • Chip Size
    3 mm
  • Compressed Air
    0.4 MPa (60L/min)
  • Frame Size
    260 x 100 mm
  • Net Weight
    2000 kg
  • Overall Dimensions
    2205 x 1415 x 1708 mm
  • Power Supply
    AC200V 30A
  • Substrate Thickness
    0.1 to 2.0 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.5 to 11 mm
  • Wafer Die Thickness
    0.1 to 0.5 mm
  • Wafer Size
    12 Inches
  • X Y Placement Accuracy
    ±38 µm

Technical Documents
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