BESTEM-D610

Note : Your request will be directed to Canon Machinery Inc.

BESTEM-D610 Image

Product Specifications

Product Details

  • Part Number
    BESTEM-D610
  • Manufacturer
    Canon Machinery Inc

General Parameters

  • Bonding Method
    Die Bonder
  • Chip Size
    0.5 mm
  • Compressed Air
    0.4 MPa (60L/min)
  • Frame Size
    300 x 102 mm
  • Net Weight
    1650 kg
  • Overall Dimensions
    2275 x 1475 x 1680 mm
  • Power Supply
    AC200V 30A
  • Substrate Thickness
    0.075 to 2.0 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    16500 UPH
  • Wafer Die Attach Size
    0.3 to 15.0 mm
  • Wafer Die Thickness
    0.05 to 0.5 mm
  • Wafer Size
    12 Inches
  • X Y Placement Accuracy
    ±20 µm

Technical Documents