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BESTEM-D631

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Product Specifications

Product Details

  • Part Number
    BESTEM-D631
  • Manufacturer
    Canon Machinery Inc

General Parameters

  • Bonding Cycle Time
    1.03 sec/chip
  • Bonding Method
    Die Bonder
  • Chip Size
    3 mm
  • Compressed Air
    0.5 MPa (150L/min)
  • Frame Size
    315 x 115 x 200 mm
  • Net Weight
    2000 kg
  • Overall Dimensions
    2422 x 1727.5 x 2332 mm
  • Power Supply
    AC200V 20A
  • Type
    Automatic
  • Wafer Die Attach Size
    1.0 to 18.0 mm
  • Wafer Die Thickness
    0.025 to 1.0 mm
  • Wafer Size
    12 Inches
  • X Y Placement Accuracy
    ± 7 µm

Technical Documents
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