AvantGo 2060P

Note : Your request will be directed to Capcon Limited Co., Ltd.

AvantGo 2060P Image

Product Specifications

Product Details

  • Part Number
    AvantGo 2060P
  • Manufacturer
    Capcon Limited Co., Ltd

General Parameters

  • Bond Force
    120 to 3200 g
  • Bond Head
    12 Heads
  • Bonding Method
    Die Bonder
  • Heated Bond Head
    160 Degree C
  • Overall Dimensions
    1480 x 1560 x 1870 mm
  • Substrate Working Range
    330 x 160 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    8000 UPH
  • Wafer Die Attach Size
    0.5 to 30 mm, 30 to 70 mm
  • Wafer Size
    12 Inches, 8 Inches
  • X Y Placement Accuracy
    5 µm

Technical Documents