1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
  5. Capcon Limited Co., Ltd
  6. AvantGo A2

AvantGo A2

Download Datasheet Request Information

Note : Your request will be directed to Capcon Limited Co., Ltd.

AvantGo A2 Image

Product Specifications

Product Details

  • Part Number
    AvantGo A2
  • Manufacturer
    Capcon Limited Co., Ltd

General Parameters

  • Bond Force
    120 to 5000 g
  • Bond Head
    4 Heads
  • Bonding Method
    Die Bonder
  • Heated Bond Head
    160 Degree C
  • Overall Dimensions
    1450 x 1775 x 1529 mm
  • Substrate Working Range
    330 x 330 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    3000 UPH
  • Wafer Die Attach Size
    0.5 to 30 mm, 30 to 100 mm
  • Wafer Size
    12 Inches, 8 Inches
  • X Y Placement Accuracy
    1.5 µm

Technical Documents
View similar products