1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
  5. Capcon Limited Co., Ltd
  6. AvantGo A6

AvantGo A6

Download Datasheet Request Information

Note : Your request will be directed to Capcon Limited Co., Ltd.

AvantGo A6 Image

Product Specifications

Product Details

  • Part Number
    AvantGo A6
  • Manufacturer
    Capcon Limited Co., Ltd

General Parameters

  • Bond Force
    120 to 3200 g
  • Bond Head
    12 Heads
  • Bonding Method
    Die Bonder
  • Heated Bond Head
    160 Degree C
  • Overall Dimensions
    1480 x 1560 x 1870 mm
  • Substrate Working Range
    330 x 300 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    up to 11000 UPH
  • Wafer Die Attach Size
    0.5 to 30 mm, 30 to 100 mm
  • Wafer Size
    12 Inches
  • X Y Placement Accuracy
    3 µm

Technical Documents
View similar products