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AvantGo L2

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AvantGo L2 Image

Product Specifications

Product Details

  • Part Number
    AvantGo L2
  • Manufacturer
    Capcon Limited Co., Ltd

General Parameters

  • Bond Force
    120 to 5000 g
  • Bond Head
    4 Heads
  • Bonding Method
    Die Bonder
  • Heated Bond Head
    160 Degree C
  • Overall Dimensions
    1480 x 2020 x 1870 mm
  • Substrate Working Range
    750 x 700 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    3000 UPH
  • Wafer Die Attach Size
    0.5 to 30 mm, 30 to 100 mm
  • Wafer Size
    12 Inches, 8 Inches
  • X Y Placement Accuracy
    2 µm

Technical Documents
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