T-4909-AE

Die Bonder by Dr. Tresky Ag (4 more products)

Note : Your request will be directed to Dr. Tresky Ag.

T-4909-AE Image

Product Specifications

Product Details

  • Part Number
    T-4909-AE
  • Manufacturer
    Dr. Tresky Ag

General Parameters

  • Bond Force
    20 to 1000 g
  • Bonding Method
    Die Bonder
  • Compressed Air
    5 to 6 bar
  • Net Weight
    33 kg
  • Overall Dimensions
    755 x 730 x 500 mm
  • Power Supply
    110V-220V
  • Standard Bond Head
    360 Degree
  • Type
    Manual
  • Wafer Size
    180 x 180 mm
  • X Y Placement Accuracy
    ± 10 µm
  • Note
    Flip Chip Placement Accuracy - 5 µm

Technical Documents