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T-5100-W

Die Bonder by Dr. Tresky Ag (4 more products)
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Product Specifications

Product Details

  • Part Number
    T-5100-W
  • Manufacturer
    Dr. Tresky Ag

General Parameters

  • Bond Force
    20 to 1000 g
  • Bonding Method
    Die Bonder
  • Net Weight
    90 kg
  • Overall Dimensions
    1155 x 790 x 728 mm
  • Power Supply
    110V-220V
  • Standard Bond Head
    360 Degree
  • Substrate Working Range
    400 x 280 mm
  • Type
    Manual
  • Wafer Size
    220 x 220 mm
  • X Y Placement Accuracy
    ± 10 µm

Technical Documents
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