MD-1412

Note : Your request will be directed to Guangzhou Minder-Hightech Co.,Ltd.

MD-1412 Image

Product Specifications

Product Details

  • Part Number
    MD-1412
  • Manufacturer
    Guangzhou Minder-Hightech Co.,Ltd

General Parameters

  • Bonding Method
    Die Bonder
  • Compressed Air
    6 bar
  • Net Weight
    1700 kg
  • Overall Dimensions
    2000 x 1200 x 1800 mm
  • Power Supply
    220 VAC, 50Hz, 600-1000 W
  • Substrate Working Range
    76 x 101 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    5000 to 6000 UPH
  • Wafer Die Attach Size
    12 x 212 mm, 1.65 x 1.65 mm, 1.20 x 1.27 mm, 1.96 x 1.51 mm
  • Wafer Size
    12 Inches, 8 Inches, 6 Inches
  • X Y Placement Accuracy
    ± 25 µm

Technical Documents