Note : Your request will be directed to Hanwha Precision Machinery Co., Ltd.

SDB-1 Image

Product Specifications

Product Details

  • Part Number
    SDB-1
  • Manufacturer
    Hanwha Precision Machinery Co., Ltd

General Parameters

  • Bond Head
    4 Heads
  • Bonding Method
    Die Bonder
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    6000 UPH
  • X Y Placement Accuracy
    ±5 µm

Technical Documents