Note : Your request will be directed to Hanwha Precision Machinery Co., Ltd.

SFM3 Image

Product Specifications

Product Details

  • Part Number
    SFM3
  • Manufacturer
    Hanwha Precision Machinery Co., Ltd

General Parameters

  • Bond Head
    4 Heads
  • Bonding Method
    Flip Chip Bonder
  • Type
    Automatic
  • Wafer Die Attach Size
    10.5 to 32 mm
  • Wafer Die Thickness
    0.04 to 3 mm
  • Wafer Flip Chip Placement Speed
    10000 UPH
  • Wafer Size
    152 to 305 mm
  • X Y Placement Accuracy
    5 µm

Technical Documents