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SFM5 Image

Product Specifications

Product Details

  • Part Number
    SFM5
  • Manufacturer
    Hanwha Precision Machinery Co., Ltd

General Parameters

  • Bond Head
    8 Heads
  • Bonding Method
    Flip Chip Bonder
  • Type
    Automatic
  • Wafer Die Attach Size
    1.5 to 12 mm, 46 mm
  • Wafer Flip Chip Placement Speed
    15000 UPH
  • Wafer Size
    8 to 12 Inches
  • X Y Placement Accuracy
    5 µm

Technical Documents