DBX-1000

Die Bonder by Kaijo Corporation

Note : Your request will be directed to Kaijo Corporation.

DBX-1000 Image

Product Specifications

Product Details

  • Part Number
    DBX-1000
  • Manufacturer
    Kaijo Corporation

General Parameters

  • Bonding Cycle Time
    0.18 sec/cycle
  • Bonding Method
    Die Bonder
  • Net Weight
    930 kg
  • Overall Dimensions
    1750 x 1080 x 2050 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.15 to 1.5 mm
  • Wafer Size
    4 Inches, 6 Inches
  • X Y Placement Accuracy
    ±25 µm

Technical Documents