APAMA PLUS-W

Note : Your request will be directed to Kulicke and Soffa Industries, Inc.

APAMA PLUS-W Image

Product Specifications

Product Details

  • Part Number
    APAMA PLUS-W
  • Manufacturer
    Kulicke and Soffa Industries, Inc

General Parameters

  • Bond Force
    3 to 300 N
  • Bonding Method
    Die Bonder
  • Cooling Rate
    140 Degree C/sec
  • Overall Dimensions
    2750 x 1860 x 2190 mm
  • Ramping Speed
    350 Degree C/sec
  • Substrate Working Range
    203 mm, 305 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    1 to 20 mm
  • Wafer Die Thickness
    75 µm
  • Wafer Size
    8 Inches, 12 Inches

Technical Documents