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AVALINE-C Image

Product Specifications

Product Details

  • Part Number
    AVALINE-C
  • Manufacturer
    Kulicke and Soffa Industries, Inc

General Parameters

  • Bond Force
    20 to 1000 g
  • Bonding Method
    Die Bonder
  • Frame Size
    300 x 105 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    2400 UPH
  • Wafer Die Attach Size
    0.25 to 10 mm
  • Wafer Die Thickness
    0.1 to 0.4 mm
  • Wafer Size
    6 Inches, 8 Inches, 12 Inches
  • X Y Placement Accuracy
    50 µm

Technical Documents