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iStack W+

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Product Specifications

Product Details

  • Part Number
    iStack W+
  • Manufacturer
    Kulicke and Soffa Industries, Inc

General Parameters

  • Bond Force
    0.5 to 25 N
  • Bonding Method
    Die Bonder
  • Bonding Tool Setting Temperature
    Up to 200 Degree C
  • Overall Dimensions
    2100 x 1930 x 1995 mm
  • Standard Bond Head
    360 Degree
  • Substrate Working Range
    152 mm, 203 mm, 305 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    5000 UPH, 9000 UPH
  • Wafer Die Attach Size
    0.8 to 15 mm
  • Wafer Die Thickness
    15 µm
  • Wafer Size
    6 Inches, 8 Inches, 12 Inches
  • X Y Placement Accuracy
    5 µm

Technical Documents
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