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Katalyst

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Katalyst Image

Product Specifications

Product Details

  • Part Number
    Katalyst
  • Manufacturer
    Kulicke and Soffa Industries, Inc

General Parameters

  • Bond Force
    0.5 to 25 N
  • Bonding Method
    Flip Chip Bonder
  • Substrate Thickness
    0.1 to 6 mm
  • Substrate Working Range
    340 x 340 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    1 to 15.5 mm
  • Wafer Die Thickness
    50 µm
  • Wafer Flip Chip Placement Speed
    15000 UPH
  • Wafer Size
    8 Inches, 12 Inches
  • X Y Placement Accuracy
    3 µm

Technical Documents
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