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6200 Image

Product Specifications

Product Details

  • Part Number
    6200
  • Manufacturer
    MicroAssembly Technologies, Ltd

General Parameters

  • Bond Force
    40 to 9000 g
  • Bonding Method
    Die Bonder
  • Net Weight
    Under 200 kg
  • Overall Dimensions
    970 x 850 x 650 mm
  • Substrate Working Range
    6 x 6 Inches
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    Up to 600 CPH
  • Wafer Die Attach Size
    0.006 to 2 Inches
  • X Y Placement Accuracy
    ± 3 µm

Technical Documents