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6400

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Product Specifications

Product Details

  • Part Number
    6400
  • Manufacturer
    MicroAssembly Technologies, Ltd

General Parameters

  • Bond Force
    40 to 4000 g
  • Bonding Method
    Die Bonder
  • Chip Trays Waffle Pack
    Up to 30 Waffle/Gel packs
  • Substrate Working Range
    10 x 12 Inches
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    Up to 1000 CPH
  • Wafer Die Attach Size
    0.006 to 1 Inches
  • Wafer Size
    300 mm
  • X Y Placement Accuracy
    ± 3 µm

Technical Documents
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