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6900/6920

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Product Specifications

Product Details

  • Part Number
    6900/6920
  • Manufacturer
    MicroAssembly Technologies, Ltd

General Parameters

  • Bond Force
    50 to 3000 g
  • Bond Head
    2 Heads
  • Bonding Method
    Die Bonder
  • Chip Trays Waffle Pack
    Up to 70 Waffle/Gel packs
  • Overall Dimensions
    1219 x 813 x 1854 mm
  • Substrate Working Range
    26 x 19 Inches
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    Up to 3000 CPH
  • Wafer Die Attach Size
    0.010 to 1 Inches
  • Wafer Die Thickness
    0.002 Inches
  • Wafer Size
    8 Inches
  • X Y Placement Accuracy
    15 µm at 3 sigma

Technical Documents
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