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NM-EFF1B

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Product Specifications

Product Details

  • Part Number
    NM-EFF1B
  • Manufacturer
    Panasonic Corporation

General Parameters

  • Bond Force
    0.5 to 10 N
  • Bond Head
    24 Heads
  • Bonding Cycle Time
    0.56 s / IC, 0.75 s/ IC
  • Bonding Method
    Die Bonder
  • Compressed Air
    0.5 Mpa 30 L/min
  • Heated Bond Head
    Up to 250 Degree C, Up to 300 Degree C
  • Net Weight
    2200 kg
  • Number of Die Types
    Up to 12 types
  • Overall Dimensions
    1950 x 1190 x 1720 mm
  • Power Supply
    3 phase AC 200 V ±10V, 50/60 Hz, 4 KVA
  • Standard Bond Head
    Up to 300 Degree C
  • Substrate Working Range
    280 x 140 mm, 200 x 150 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.25 x 0.25 mm to 6 x 6 mm
  • X Y Placement Accuracy
    7 µm, 15 µm, 25 µm

Technical Documents
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