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NM-EFF1C

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Product Specifications

Product Details

  • Part Number
    NM-EFF1C
  • Manufacturer
    Panasonic Corporation

General Parameters

  • Bond Force
    1 to 50 N
  • Bonding Cycle Time
    0.65 s/IC
  • Bonding Method
    Flip Chip Bonder
  • Compressed Air
    0.4 Mpa 50 L/min
  • Net Weight
    2300 kg
  • Number of Die Types
    Up to 12 types
  • Overall Dimensions
    1380 x 1640 x 1430 mm
  • Power Supply
    3 phase AC 200 V ±10V, 50/60 Hz, 4 KVA
  • Substrate Working Range
    330 x 330 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    25 x 25 mm
  • Wafer Size
    305 mm
  • X Y Placement Accuracy
    5 µm

Technical Documents
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