PCA-200

Die Bonder by Protec Co., Ltd

Note : Your request will be directed to Protec Co., Ltd.

PCA-200 Image

Product Specifications

Product Details

  • Part Number
    PCA-200
  • Manufacturer
    Protec Co., Ltd

General Parameters

  • Bond Force
    1 to 20 Kgf
  • Bonding Method
    Die Bonder
  • Heated Bond Head
    -150 Degree C, -400 Degree C
  • Mean Time Between Failure
    < 1 hrs
  • Substrate Working Range
    300 x 200 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    1 to 60 mm
  • X Y Placement Accuracy
    ± 7 µm

Technical Documents