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FCB-200

Die Bonder by SEC Co.,Ltd (1 more product)
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Product Specifications

Product Details

  • Part Number
    FCB-200
  • Manufacturer
    SEC Co.,Ltd

General Parameters

  • Bond Force
    10 to 343 N
  • Bonding Cycle Time
    1.7 sec
  • Bonding Method
    Flip Chip Bonder
  • Heated Bond Head
    30 to 550 Degree C
  • Overall Dimensions
    2680 x 1440 x 1850 mm
  • Type
    Automatic
  • Wafer Size
    6 Inches, 8 Inches
  • X Y Placement Accuracy
    20 µm

Technical Documents
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