FCB-300

Die Bonder by SEC Co.,Ltd (1 more product)

Note : Your request will be directed to SEC Co.,Ltd.

FCB-300 Image

Product Specifications

Product Details

  • Part Number
    FCB-300
  • Manufacturer
    SEC Co.,Ltd

General Parameters

  • Bond Force
    10 to 343 N
  • Bonding Cycle Time
    1.3 sec
  • Bonding Method
    Flip Chip Bonder
  • Heated Bond Head
    30 to 550 Degree C
  • Overall Dimensions
    2894 x 1624 x 1840 mm
  • Type
    Automatic
  • Wafer Size
    8 Inches, 12 Inches
  • X Y Placement Accuracy
    1.5 µm

Technical Documents