1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
  5. Shenzhen Asmade Semiconductor TechnologyCo.,Ltd
  6. AS-0829

AS-0829

Download Datasheet Request Information

Note : Your request will be directed to Shenzhen Asmade Semiconductor TechnologyCo.,Ltd.

AS-0829 Image

Product Specifications

Product Details

  • Part Number
    AS-0829
  • Manufacturer
    Shenzhen Asmade Semiconductor TechnologyCo.,Ltd

General Parameters

  • Bonding Method
    Die Bonder
  • Overall Dimensions
    3950 x 1200 x 1650 mm
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    90000 UPH
  • Wafer Die Attach Size
    1.52 x 1.52 mm
  • X Y Placement Accuracy
    ± 50 µm

Technical Documents
View similar products