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AFM-15 (1503)

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AFM-15 (1503) Image

Product Specifications

Product Details

  • Part Number
    AFM-15 (1503)
  • Manufacturer
    TDK Corporation

General Parameters

  • Bond Force
    25 N, 50 N, 100 N
  • Bonding Cycle Time
    0.8 sec/chip
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    2.5 x 2.5 mm
  • Net Weight
    1800 kg
  • Overall Dimensions
    1200 x 1450 x 1650 mm
  • Substrate Thickness
    3 mm
  • Substrate Working Range
    180 x 120 mm
  • Type
    Automatic
  • Wafer Size
    5 Inches, 6 Inches, 8 Inches, 12 Inches
  • X Y Placement Accuracy
    ± 7 µm

Technical Documents
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