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AFM-25

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AFM-25 Image

Product Specifications

Product Details

  • Part Number
    AFM-25
  • Manufacturer
    TDK Corporation

General Parameters

  • Bond Force
    372.4 N
  • Bonding Cycle Time
    2.5 sec/chip
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    30 x 30 mm
  • Net Weight
    1100 kg
  • Overall Dimensions
    750 x 910 x 1760 mm
  • Substrate Thickness
    1.6 mm
  • Substrate Working Range
    200 x 120 mm
  • Type
    Automatic
  • Wafer Size
    2 Inches
  • X Y Placement Accuracy
    ± 2 µm

Technical Documents
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