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Transform

Thin Film Deposition Equipment by Beneq, Inc (9 more products)
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Product Specifications

Product Details

  • Part Number
    Transform
  • Manufacturer
    Beneq, Inc

General Parameters

  • ALD Processes
    Al2O3, SiO2, HfO2, Ta2O5, TiO2, TiN, AlN, SiNx, ZnO, ZrO
  • Batch Size
    200 mm x 25 wafers
  • Cooling Option
    Built-In
  • Integration
    SECS/GEM
  • Maximum Configuration
    3 ALD Modules + Pre-Heater
  • Number Of Plasma Lines
    2 + 2 optional
  • Overall Dimensions
    3120 x 4070 x 2140 mm
  • Temperature Range
    25 to 420 Degree C
  • Throughput
    15 wafers/hour (1PM), >40 wafers/hour (3PM’s)
  • Transfer Module
    Brooks Mx600SS
  • Type
    ALD Process
  • VCE Loadlocks
    2
  • Wafer Size
    3 Inches, 4 Inches, 6 Inches, 8 Inches

Technical Documents
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