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Transform 300

Thin Film Deposition Equipment by Beneq, Inc (9 more products)
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Product Specifications

Product Details

  • Part Number
    Transform 300
  • Manufacturer
    Beneq, Inc

General Parameters

  • ALD Processes
    Al2O3, SiO2, HfO2, Ta2O5, TiO2, AlN, TiN, ZnO, Si3N4
  • Batch Size
    25 x 300 mm wafers
  • Cooling Option
    Built-in
  • Integration
    SECS/GEM
  • Maximum Configuration
    3 Processing Modules & 1 Preheater
  • Number Of Plasma Lines
    3+1 optional
  • Overall Dimensions
    4400 x 4800 x 2250 mm
  • Safety Standards
    SEMI S2 and S8
  • Temperature Range
    420 Degree C (Batch), 350 Degree C (Plasma)
  • Throughput
    12 wafers/hour – 1 batch PM
  • Transfer Module
    M2C5
  • Type
    ALD Process
  • Wafer Size
    300 mm with 200 mm Bridge Capability

Technical Documents
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