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300SCGII

Wafer Grinding Equipment by Joen Lih Machinery Co., Ltd (2 more products)
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Product Specifications

Product Details

  • Part Number
    300SCGII
  • Manufacturer
    Joen Lih Machinery Co., Ltd

General Parameters

  • Maximum Speed
    300 mm/min
  • Net Weight
    3000 kg
  • Overall Dimensions
    1100 x 1950 x 2100 mm
  • Rated Output
    11 kW
  • Resolution
    0.1 µm
  • Spindle Rotation Speed
    1000 to 3000 rpm
  • Surface Roughness
    Ra 0.02 µm
  • Wafer Size
    300 mm
  • Wheel Size
    350 mm
  • Work Table Spindle
    0 to 500 rpm

Technical Documents