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JL-200SCG

Wafer Grinding Equipment by Joen Lih Machinery Co., Ltd (2 more products)
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Product Specifications

Product Details

  • Part Number
    JL-200SCG
  • Manufacturer
    Joen Lih Machinery Co., Ltd

General Parameters

  • Maximum Speed
    300 mm/min
  • Net Weight
    2000 kg
  • Overall Dimensions
    600 x 1700 x 2100 mm
  • Rated Output
    3.7 kW
  • Resolution
    0.1 µm
  • Spindle Rotation Speed
    1000 to 5000 rpm
  • Surface Roughness
    Ra 0.02 µm
  • Wafer Size
    200 mm
  • Wheel Size
    250 mm
  • Work Table Spindle
    0 to 500 rpm

Technical Documents