1. Home
  2. Semiconductor Equipment
  3. Wafer Manufacturing Equipment
  4. Wafer Grinding Equipment
Filters

Wafer Grinding Equipment - Page 5

46 Wafer Grinding Equipment from 15 Manufacturers meet your specification.
 Download Datasheet  Request Information  Product Details

Suzhou HRT Electronic Equipment Tech Co., Ltd - 16B series

Wafer Grinding Equipment from Suzhou HRT Electronic Equipment Tech Co., Ltd
 Download Datasheet  Request Information
Net Weight:
7000 kg
Overall Dimensions:
2530 x 1680 x 2830 mm
Rated Output:
12.5 kW, 14.7 kW, 22.7 kW
Wafer Size:
340 mm
Wheel Size:
1112 x 380 x 50 mm
more info
 Download Datasheet  Request Information  Product Details

Suzhou HRT Electronic Equipment Tech Co., Ltd - 16S series

Wafer Grinding Equipment from Suzhou HRT Electronic Equipment Tech Co., Ltd
 Download Datasheet  Request Information
Net Weight:
5500 kg
Overall Dimensions:
2000 x 1400 x 2670 mm
Rated Output:
15 kW
Wafer Size:
340 mm
Wheel Size:
1118 x 386 x 50 mm
more info
 Download Datasheet  Request Information  Product Details

Suzhou HRT Electronic Equipment Tech Co., Ltd - 18B series

Wafer Grinding Equipment from Suzhou HRT Electronic Equipment Tech Co., Ltd
 Download Datasheet  Request Information
Net Weight:
7800 kg
Overall Dimensions:
2700 x 1950 x 2780 mm
Rated Output:
25.45 kW
Wafer Size:
280 mm
Wheel Size:
1257 x 723 x 60 mm
more info
 Download Datasheet  Request Information  Product Details

Suzhou HRT Electronic Equipment Tech Co., Ltd - DPG700

Wafer Grinding Equipment from Suzhou HRT Electronic Equipment Tech Co., Ltd
 Download Datasheet  Request Information
Net Weight:
6000 kg
Overall Dimensions:
2200 x 2160 x 2600 mm
Rated Output:
18.75 kW
Spindle Rotation Speed:
160 rpm
Thickness Gauge:
75 mm
Wafer Size:
180 mm
Wheel Size:
238 mm
more info
 Download Datasheet  Request Information  Product Details

Jiangsu Jinggong Semiconductor Equipment Co., Ltd - MET-5600

Wafer Grinding Equipment from Jiangsu Jinggong Semiconductor Equipment Co., Ltd
 Download Datasheet  Request Information
Net Weight:
3000 kg
Overall Dimensions:
2200 x 1500 x 2200 mm
Spindle Accuracy:
±1 µm
Spindle Rotation Speed:
50000 to 160000 rpm
Thickness Gauge:
250 to 1000 µm
Wafer Size:
2 to 6 Inches, 4 to 8 Inches
Wheel Size:
200 mm, 202 mm
more info
 Download Datasheet  Request Information  Product Details

Jiangsu Jinggong Semiconductor Equipment Co., Ltd - MET-5800

Wafer Grinding Equipment from Jiangsu Jinggong Semiconductor Equipment Co., Ltd
 Download Datasheet  Request Information
Net Weight:
3000 kg
Overall Dimensions:
3300 x 2200 x 2200 mm
Spindle Accuracy:
±1 µm
Spindle Rotation Speed:
50000 to 160000 rpm
Thickness Gauge:
250 to 1000 µm
Wafer Size:
12 Inches
Wheel Size:
200 mm, 202 mm
more info
Have a Custom Requirement?
Wafer Grinding Equipment Directory