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Wafer Grinding Equipment - Page 2

46 Wafer Grinding Equipment from 15 Manufacturers meet your specification.
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Disco Corporation - DFG8830

Wafer Grinding Equipment from Disco Corporation
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Grinding Method:
In-Feed Grinding
Net Weight:
6000 kg
Overall Dimensions:
1400 x 2500 x 2000 mm
Rated Output:
6.3 kW
Spindle Rotation Speed:
1000 to 4000 rpm
Wafer Size:
4 Inches, 5 Inches, 6 Inches, 8 Inches
Wheel Size:
300 mm
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Engis Corporation - EAG-28SAND

Wafer Grinding Equipment from Engis Corporation
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Automatic Dressing System:
400 rpm/ 200W/ 90 x 30 mm
Automatic Measuring System:
1 Probe, 5 mm (max Height)
Minimum Feed Speed:
0.1 µm/sec +
Net Weight:
3900 kg
Overall Dimensions:
2200 x 1800 x 2300 mm
Rated Output:
9.5 kW, 1.5 kW
Resolution:
0.1 µm
Spindle Rotation Speed:
4000 rpm
Wafer Size:
200 mm, 300 mm
Wheel Size:
303 mm
Work Table Spindle:
260 rpm
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Engis Corporation - EAG-28SDANX (8")

Wafer Grinding Equipment from Engis Corporation
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Automatic Measuring System:
Non Contact Gauge (in-Process)
Minimum Feed Speed:
0.1 µm/sec +
Net Weight:
5900 kg
Overall Dimensions:
2700 x 1800 x 2280 mm
Rated Output:
6 kW, 0.75 kW
Resolution:
0.1 µm
Spindle Rotation Speed:
6000 rpm
Wafer Size:
200 mm
Wheel Size:
203 mm
Work Table Spindle:
400 rpm
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Engis Corporation - EAG-28SDANX (12")

Wafer Grinding Equipment from Engis Corporation
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Automatic Measuring System:
Non Contact Gauge (in-Process)
Minimum Feed Speed:
0.1 µm/sec +
Net Weight:
6100 kg
Overall Dimensions:
2700 x 1800 x 2350 mm
Rated Output:
9 kW, 1.5 kW
Resolution:
0.1 µm
Spindle Rotation Speed:
4000 rpm
Wafer Size:
300 mm
Wheel Size:
303 mm
Work Table Spindle:
260 rpm
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Grintimate Precision Co., Ltd - GTR-1215

Wafer Grinding Equipment from Grintimate Precision Co., Ltd
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Minimum Feed Speed:
0.1 µm/sec +
Net Weight:
3200 kg
Overall Dimensions:
1872 x 1215 x 2380 mm
Spindle Accuracy:
0.001 mm
Spindle Rotation Speed:
0 to 3000 rpm
Vacuum:
4 to 12 mm
Wafer Size:
4 to 12 Inches
Wheel Size:
304 mm
Work Table Spindle:
5 to 300 rpm
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Joen Lih Machinery Co., Ltd - JL-200SCG

Wafer Grinding Equipment from Joen Lih Machinery Co., Ltd
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Maximum Speed:
300 mm/min
Net Weight:
2000 kg
Overall Dimensions:
600 x 1700 x 2100 mm
Rated Output:
3.7 kW
Resolution:
0.1 µm
Spindle Rotation Speed:
1000 to 5000 rpm
Surface Roughness:
Ra 0.02 µm
Wafer Size:
200 mm
Wheel Size:
250 mm
Work Table Spindle:
0 to 500 rpm
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Joen Lih Machinery Co., Ltd - 300SCGII

Wafer Grinding Equipment from Joen Lih Machinery Co., Ltd
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Maximum Speed:
300 mm/min
Net Weight:
3000 kg
Overall Dimensions:
1100 x 1950 x 2100 mm
Rated Output:
11 kW
Resolution:
0.1 µm
Spindle Rotation Speed:
1000 to 3000 rpm
Surface Roughness:
Ra 0.02 µm
Wafer Size:
300 mm
Wheel Size:
350 mm
Work Table Spindle:
0 to 500 rpm
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Joen Lih Machinery Co., Ltd - JL-D16

Wafer Grinding Equipment from Joen Lih Machinery Co., Ltd
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Max Load Pressure:
10 to 300 kg
Net Weight:
6200 kg
Overall Dimensions:
2300 x 1420 x 2550 mm
Power Supply:
3Ø 220V (3Ø 380V)
Spindle Rotation Speed:
20 to 60 rpm
Thickness Gauge:
0.4 to 40 mm
Upper Lower Drive Power:
5 HP, 15 HP
Wafer Size:
6 Inches, 8 Inches 12 Inches
Wheel Size:
370 mm
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Komatsu (Dalian) Machine Tool Corp - GCG300

Wafer Grinding Equipment from Komatsu (Dalian) Machine Tool Corp
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Overall Dimensions:
2370 x 3500 x 2500 mm
Spindle Rotation Speed:
600 to 3000 rpm
Wafer Size:
300 mm
Wheel Size:
120 mm
Work Table Spindle:
0 to 450 rpm
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Lapmaster Wolters GmbH - AC microLine 700 F

Wafer Grinding Equipment from Lapmaster Wolters GmbH
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Center Drive Speed:
83 rpm
Max Load Pressure:
1000 daN, 1800 daN
Net Weight:
4000 kg
Overall Dimensions:
2200 x 1900 x 1900 mm
Rated Output:
2.5 kW
Spindle Rotation Speed:
300 rpm, 420 rpm
Thickness Gauge:
75 mm
Upper Lower Drive Power:
24 kW, 36 kW
Wafer Size:
200 mm
Wheel Size:
720 mm
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