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Wafer Grinding Equipment - Page 3

46 Wafer Grinding Equipment from 15 Manufacturers meet your specification.
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Lapmaster Wolters GmbH - AC microLine 700 F, H, D

Wafer Grinding Equipment from Lapmaster Wolters GmbH
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Center Drive Speed:
83 rpm
Max Load Pressure:
1000 daN, 1800 daN
Net Weight:
4000 kg
Overall Dimensions:
2200 x 1900 x 1900 mm
Rated Output:
2.5 kW
Spindle Rotation Speed:
160 rpm
Thickness Gauge:
75 mm
Upper Lower Drive Power:
12 kW
Wafer Size:
200 mm
Wheel Size:
720 mm
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Lapmaster Wolters GmbH - AC 700 L,P

Wafer Grinding Equipment from Lapmaster Wolters GmbH
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Center Drive Speed:
83 rpm
Max Load Pressure:
1000 daN, 1800 daN
Net Weight:
4000 kg
Overall Dimensions:
2200 x 1900 x 1900 mm
Rated Output:
2.5 kW
Spindle Rotation Speed:
160 rpm
Thickness Gauge:
75 mm
Upper Lower Drive Power:
12 kW
Wafer Size:
220 mm, 240 mm
Wheel Size:
740 mm, 760 mm
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Logomatic GmbH - Q2

Wafer Grinding Equipment from Logomatic GmbH
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Net Weight:
4082 kg
Overall Dimensions:
1600 x 1600 x 1900 mm
Power Supply:
15 kW
Wafer Size:
6 Inches, 8 Inches
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Micro Engineering Inc - CMG-802XJ

Wafer Grinding Equipment from Micro Engineering Inc
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Thickness Gauge:
30 µm
Wafer Size:
8 Inches, 12 Inches
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N-Tec Corp - 518A

Wafer Grinding Equipment from N-Tec Corp
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Compressed Air:
5 Kgf/cm2
Net Weight:
5050 kg
Overall Dimensions:
1440 x 1865 x 2440 mm
Power Supply:
3 Ø 220 V
Wafer Size:
2 to 4 Inches
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N-Tec Corp - 519A

Wafer Grinding Equipment from N-Tec Corp
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Compressed Air:
5 Kgf/cm2
Net Weight:
5050 kg
Overall Dimensions:
1440 x 1865 x 2440 mm
Power Supply:
3 Ø 220 V
Wafer Size:
2 to 6 Inches
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N-Tec Corp - 629A

Wafer Grinding Equipment from N-Tec Corp
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Compressed Air:
5 Kgf/cm2
Net Weight:
2800 kg
Overall Dimensions:
1350 x 1550 x 2555 mm
Power Supply:
3 Ø 220 V
Wafer Size:
2 to 6 Inches
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Revasum - 7AF-HMG

Wafer Grinding Equipment from Revasum
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Net Weight:
3865 kg
Overall Dimensions:
1860 x 2150 x 2460 mm
Spindle Accuracy:
1 µm
Spindle Rotation Speed:
500 to 4300 rpm
Surface Roughness:
200 Å to 30 Å
Wafer Size:
50 to 200 mm
Work Table Spindle:
20 to 700 rpm
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Shenyang Hanway Technology Co., Ltd - HAD3610

Wafer Grinding Equipment from Shenyang Hanway Technology Co., Ltd
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Minimum Feed Speed:
0.1 to 600 mm/sec
Net Weight:
1500 kg
Overall Dimensions:
1080 x 1020 x 1800 mm
Rated Output:
2.4 kW
Repeat Accuracy:
0.001 mm
Spindle Accuracy:
0.003 mm
Spindle Rotation Speed:
3000 to 60000 rpm
Wafer Size:
300 x 300 mm
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Shenyang Hanway Technology Co., Ltd - HAD3310

Wafer Grinding Equipment from Shenyang Hanway Technology Co., Ltd
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Minimum Feed Speed:
0.1 to 400 mm/sec
Net Weight:
580 kg
Overall Dimensions:
910 x 1100 x 1860 mm
Power Supply:
Single Phase, AC 220 +/-10%
Rated Output:
2.4 kW
Repeat Accuracy:
0.001 mm
Resolution:
1 Inches
Spindle Accuracy:
0.002 mm
Spindle Rotation Speed:
3000 to 60000 rpm
Wafer Size:
300 mm, 280 mm
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