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XB8

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Product Specifications

Product Details

  • Part Number
    XB8
  • Manufacturer
    SUSS MicroTec SE

General Parameters

  • Bond Force
    60 kN, 100 kN
  • Bond Force Repeatability
    < ± 2%
  • Bonding Method
    Wafer Bonder
  • Bonding Tool Setting Temperature
    Up to 550 Degree C
  • Chamber Pressure
    5 x 10-5 mbar
  • Compressed Air
    6 to 7 bar
  • Cooling Rate
    Up to 30 K/min
  • Net Weight
    700 kg
  • Overall Dimensions
    1469 x 778 x 1710 mm
  • Substrate Working Range
    4 Inches, 6 Inches, 8 Inches
  • Temperature Uniformity
    1.50%
  • Type
    Automatic
  • Wafer Size
    4 Inches, 6 Inches, 8 Inches

Technical Documents
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