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AFM-15 (1504)

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AFM-15 (1504) Image

Product Specifications

Product Details

  • Part Number
    AFM-15 (1504)
  • Manufacturer
    TDK Corporation

General Parameters

  • Bond Force
    25 N, 50 N, 100 N
  • Bonding Cycle Time
    0.75 sec/chip
  • Bonding Method
    Flip Chip Bonder
  • Chip Size
    2.5 x 2.5 mm
  • Net Weight
    1500 kg
  • Overall Dimensions
    980 x 1020 x 1860 mm
  • Substrate Thickness
    3 mm
  • Substrate Working Range
    170 x 105 mm
  • Type
    Automatic
  • Wafer Size
    5 Inches, 6 Inches
  • X Y Placement Accuracy
    ± 7 µm

Technical Documents
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