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XBS200

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Product Specifications

Product Details

  • Part Number
    XBS200
  • Manufacturer
    SUSS MicroTec SE

General Parameters

  • Bond Force
    Up 60 kN, 100 kN
  • Bond Force Repeatability
    < ± 2%
  • Bonding Method
    Wafer Bonder
  • Bonding Tool Setting Temperature
    Up to 550 Degree C
  • Chamber Pressure
    5 x 10-5 mbar to 3 bar
  • Cooling Rate
    30 K/min
  • Temperature Uniformity
    < 1 %
  • Type
    Automatic
  • Wafer Size
    Up to 200 mm

Technical Documents
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