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YSH20 Image

Product Specifications

Product Details

  • Part Number
    YSH20
  • Manufacturer
    Yamaha Motor Corporation

General Parameters

  • Bond Head
    8 Heads
  • Bonding Cycle Time
    0.8 sec/unit, 1 sec/unit
  • Bonding Method
    Flip Chip Bonder
  • Compressed Air
    5 bar
  • Net Weight
    2780 kg
  • Overall Dimensions
    1400 x 2035 x 1515 mm
  • Power Supply
    3-phase AC 200-416V, +/- 10%, 50/60 Hz
  • Type
    Automatic
  • Wafer Die Attach Size
    0.6 to 18 mm
  • Wafer Flip Chip Placement Speed
    4500 UPH
  • Wafer Size
    6 Inches, 8 Inches, 12 Inches
  • X Y Placement Accuracy
    ± 10 µm

Technical Documents