Wafer Etching System - Page 4

33 Wafer Etching System from 17 Manufacturers meet your specification.
Applications:
RIE processing for various wafer electronic components
Net Weight:
4500 kg
Overall Dimensions:
4000 x 3000 x 2200 mm
Power Supply:
AC200V(3f)/49kVA(143A)
Process Type:
Dry Etching
Wafer Size:
4 to 6 Inches
more info
Applications:
RIE processing for various wafer electronic components
Net Weight:
2400 kg
Overall Dimensions:
2800 x 2400 x 2025 mm
Power Supply:
AC200V(3f)/25kVA(73A)
Process Type:
Dry Etching
Wafer Size:
4 to 6 Inches
more info