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Wafer Automated Optical Inspection (AOI) Equipment - Page 2

38 Wafer Automated Optical Inspection (AOI) Equipment from 17 Manufacturers meet your specification.
MVP 900 + LP15 Image
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Machine Vision Products, Inc - MVP 900 + LP15

Wafer Automated Optical Inspection (AOI) Equipment from Machine Vision Products, Inc
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3D Sensor XY Resolution:
5 µm
3D Speed:
2.4 cm2/s
Air Supply:
60 PSI, 1CFM
Camera:
25 MP, 12 MP
Inspection Area:
355 x 355 mm
Light Source:
Multi-Tier Lighting
Net Weight:
680 kg
Overall Dimensions:
844 x 1066 x 1473 mm
Power Supply:
208-240VAC 50/60 Hz, 10A
Resolution:
0.5 µm, 0.3 to 5 µm
Type:
Wafer Die Inspection & Wafer Wire Bond Inspection
Wafer Size:
100 to 300 mm
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MVP 900 + Micro Image
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Machine Vision Products, Inc - MVP 900 + Micro

Wafer Automated Optical Inspection (AOI) Equipment from Machine Vision Products, Inc
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3D Sensor XY Resolution:
250 to 350 nm
Air Supply:
60 PSI, 1CFM
Camera:
25 MP, 12 MP
Inspection Area:
355 x 355 mm
Light Source:
Multi-Tier Lighting
Net Weight:
680 kg
Overall Dimensions:
844 x 1066 x 1473 mm
Power Supply:
208-240VAC 50/60 Hz, 10A
Resolution:
0.5 µm, 0.3 to 5 µm
Type:
Wafer Die Inspection & Wafer Wire Bond Inspection
Wafer Size:
100 to 300 mm
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WI300 Image
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Micro Modular System Sdn. Bhd - WI300

Wafer Automated Optical Inspection (AOI) Equipment from Micro Modular System Sdn. Bhd
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Accuracy:
0.25 mm
Camera:
65 MP
Field of View:
14.9 x 11.2 mm
Inspection Speed:
10000 uph, 20000 uph
Magnification:
2X
Overall Dimensions:
1250 x 2400 x 2050 mm
Type:
Wafer Wire Bond Inspection
Wafer Size:
4 to 6 Inches
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nSpec LS Image
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Nanotronics - nSpec LS

Wafer Automated Optical Inspection (AOI) Equipment from Nanotronics
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Centered Load Capability:
2.27 kg
Light Source:
LED
Magnification:
5X, 10X, 20X, 50X
Net Weight:
240 kg
Overall Dimensions:
1650 x 1570 x 1940 mm
Power Supply:
208?-240 VAC, 15A, 50?-60 Hz
Repeatability:
0.5 µm
Resolution:
50 nm
Stage Flatness:
30 µm
Type:
Wafer AOI
X and Y Travel Area:
200 mm
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nSpec PS Image
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Nanotronics - nSpec PS

Wafer Automated Optical Inspection (AOI) Equipment from Nanotronics
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Cassette Load Port:
25 Wafers/cassette, Standard H-Bar Cassette
Centered Load Capability:
2.27 kg
Light Source:
White Light LED
Magnification:
2.5X, 5X, 10X, 20X, 50X
Net Weight:
363 kg
Overall Dimensions:
2360 x 1570 x 1940 mm
Power Supply:
208?-240 VAC, 15A, 50/60 Hz
Repeatability:
0.5 µm
Resolution:
50 nm
Stage Flatness:
30 µm
Type:
Wafer AOI
Wafer Size:
50 to 200 mm
X and Y Travel Area:
200 mm
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nSpec CPS Image
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Nanotronics - nSpec CPS

Wafer Automated Optical Inspection (AOI) Equipment from Nanotronics
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Air Supply:
60 PSI (415 kPa)
Cassette Load Port:
200 mm cassette adapter for Load Port
Centered Load Capability:
5 kg
Light Source:
White Light LED
Magnification:
2.5X, 5X, 10X, 20X, 50X
Net Weight:
1180 kg
Overall Dimensions:
2400 x 1940 x 2620 mm
Power Supply:
208?-240 VAC, 15A, 50/60 Hz
Repeatability:
+/- 2 µm
Resolution:
50 nm
Stage Flatness:
20 µm
Type:
Wafer AOI
X and Y Travel Area:
350 mm
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nSpec Turbo Image
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Nanotronics - nSpec Turbo

Wafer Automated Optical Inspection (AOI) Equipment from Nanotronics
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Air Supply:
60 PSI (415 kPa)
Cassette Load Port:
200 mm cassette adapter for Load Port
Centered Load Capability:
12.5 kg
Light Source:
White Light LED
Magnification:
1.25X, 2.5X, 10X, 20X, 50X
Net Weight:
1200 kg
Overall Dimensions:
2400 x 1940 x 2620 mm
Power Supply:
208VAC, 15A, 50-60Hz
Repeatability:
2 µm
Resolution:
50 nm
Stage Flatness:
20 µm
Type:
Wafer AOI
X and Y Travel Area:
350 mm
more info
nSpec PRISM Image
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Nanotronics - nSpec PRISM

Wafer Automated Optical Inspection (AOI) Equipment from Nanotronics
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Cassette Load Port:
25 wafers / cassette, single Standard H-Bar
Centered Load Capability:
2.27 kg
Light Source:
LED, UV LED, White
Magnification:
1.25X, 2X, 2.5X, 4X, 5X, 10X, 20X, 50X
Net Weight:
363 kg
Overall Dimensions:
2360 x 1570 x 1940 mm
Power Supply:
208?-240 VAC, 15A, 50/60 Hz
Repeatability:
0.5 µm
Resolution:
50 nm
Stage Flatness:
30 µm
Type:
Wafer AOI
Wafer Size:
50 to 200 mm
X and Y Travel Area:
200 x 200 mm
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OPTISTATION-3000 Series Image
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Nikon Precision Inc - OPTISTATION-3000 Series

Wafer Automated Optical Inspection (AOI) Equipment from Nikon Precision Inc
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Defects:
Process Defects, Particles and Scratches
Magnification:
5X, 10X, 20X, 50X, 100X, 150X
Type:
Macro inspection
Wafer Size:
200 mm, 300 mm
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Xceed MICRO Image
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PARMI Co., Ltd - Xceed MICRO

Wafer Automated Optical Inspection (AOI) Equipment from PARMI Co., Ltd
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Bottom Clearance:
15 mm
Bottom Edge Clearance:
3.3 mm
Camera:
4 MP
Conveyor Height:
860 to 970 mm
Conveyor Speed:
300 to 800 mm/sec
Defects:
Die Tilt, Chipping, Misalignment, Crack, Epoxy Coverage, Runout Measurement, Bridge, Height, Area, Volume, Coplanarity, Cu Clip Height, Fillet Coverag...
Height Accuracy:
2 µm
Height Repeatability:
3 sigma < 3 µm
Light Source:
R.G.B LED 3 Stage Lightings
Max Component Height:
5 mm, 15 mm
Net Weight:
730 kg
Overall Dimensions:
850 x 1205 x 1525 mm
Resolution:
3.5 x 3.5 µm, 7 x 7 µm
Top Clearance:
30 mm
Top Edge Clearance:
2.5 mm
Type:
AOI for Semiconductor Packaging
Wafer Size:
410 x 350 mm
Wafer Thickness:
0.08 to 5 mm
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